Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM

This study presents the parametric investigation of a phase change material (PCM) filled plate-fin heat sink, used for thermal management (TM) electronic components. Two-dimensional (2D) unsteady numerical simulations were carried out using finite-volume-method. The which is acting as conductivity enhancer (TCE), employed with PCM to improve transfer enhancement. Two different volume fractions 10% and 20% sinks 10, 15 20 mm fin heights selected RT-35HC absorb internally generated by A constant input power, mimic device generated, was provided at sink base transient variations temperature distributions, melt-fraction, phase-change field, flow field latent-heat analysed. performance further investigated dimensional analysis critical set point (SPTs). results revealed that reduced improved uniformity melting compared without fins but sink. lower achieved increase height number both fins. Compared fraction finned showed better reduction in temperature. However, higher completion time during predicted obtained